Probe station is a wafer probe testing equipment, which plays an important role in the semiconductor device manufacturing process. Through probe testing, abnormal grains in the wafer can be detected in a timely manner, reducing the processing cost of subsequent processes.

Environmental Stress Screening (ESS) test is a testing method that simulates the use of products under extreme environmental conditions to detect potential defects in product design and manufacturing processes.

Thermal compression bonding (TCB) process is a key technology in advanced packaging, which can integrate high-density components such as 3D stacked chips and high bandwidth memory (HBM).

Semiconductor equipment chiller, also known as semiconductor cooler, is a device used in the semiconductor manufacturing process to cool equipment or processes

Integrated circuit testing is the process of verifying the functionality and performance of integrated circuit chips during and after the manufacturing process to ensure their quality and reliability.

In the trend of semiconductor transistor size becoming smaller and chip functionality becoming increasingly complex, system level testing (SLT) has become crucial.

Chip aging test is a method of conducting long-term operation and load testing on chips to simulate the aging situation of chips in actual use.

ATE machines can be divided into four categories based on the type of testing chip: memory testing system, digital circuit testing system, analog circuit testing system, and mixed signal circuit testing system.