The basic principle of integrated circuit testing is to apply excitation to the chip through test vectors, measure the chip's response output, and compare it with the predicted results in advance.

Electrostatic chuck is a typical segmented component market that plays an important role in multiple aspects of semiconductor manufacturing processes.

The key to HBM manufacturing is the TSV process, which aims to drill holes on the chip. This can reduce resistance and accelerate data transmission speed.

Electrostatic discharge (ESD) should be the main culprit causing electrical over stress (EOS) damage to all electronic components or integrated circuit systems.

Optoelectronic devices are an important component of the electronic information industry and are key and core components of optoelectronic technology.

The 400G optical module is mainly used for photoelectric conversion. The electrical signal is converted into an optical signal at the transmitting end, and then transmitted through optical fiber. At the receiving end, the optical signal is converted into an electrical signal.

The Double 85 Test is an environmental stress acceleration test typically conducted at a temperature of 85 ℃ and a humidity of 85% RH. This type of test is mainly used to evaluate the performance and stability of products in high temperature and high humidity environments.

By using SLT to perform functional testing on the test chip in a simulated terminal environment, equipment manufacturers can prevent missed detection faults that are difficult to detect using traditional wafer and packaging testing techniques.