As a core component of automobiles, strict testing of automotive grade chips is an important means to ensure the quality and safety of automobiles.

High Accelerated Damp Heat Test (HAST), as an effective testing method, plays a crucial role in evaluating the weather resistance performance of fluorinated photovoltaic backboards.

AEC-Q is a reliability testing standard for vehicles, mainly aimed at strict quality and reliability confirmation of on-board chips, especially for standard specification testing of product functions and performance.

ThermoChamber spare parts maintenance plays a crucial role in all maintenance, and daily maintenance cannot be ignored.

The two box cold and hot shock test chamber is a device used to test the tolerance of products. By constantly changing the temperature, it detects whether the product is damaged. The thermal and cooling effects generated will simulate climate change in various extreme scenarios.

The Bench Top Temperature Forcing System ThermoTST ATC series adopts advanced design and technology, with a wide temperature range

Types and testing conditions of wafer temperature cycle reliability testing

Wafer back cooling technology, as an effective temperature management method, not only ensures the uniformity of wafer temperature, but also enhances the stability during wafer processing.