WAT test structure usually includes all active and passive components of the process platform

After the chip is packaged, there may be potential defects, which may lead to unstable chip performance or potential defects in function.

SOC design process, including the whole process of digital circuit design front-end and back-end.

Chip testing is an important link to ensure product yield and cost control.

This year's midterm report shows that the performance of domestic semiconductor equipment listed companies has accelerated, the orders of domestic semiconductor equipment listed companies have generally increased at a high rate, and the contractual liabilities have increased significantly.

Reliability of components refers to the ability of products to complete specified functions within specified time and under specified conditions

MEMS is a manufacturing technology, such as levers, gears, pistons, engines and even steam engines are all made by MEMS.

After photolithography of the circuit diagram is completed on the wafer, the etching process is used to remove any excess oxide film and leave only the semiconductor circuit diagram.