Product details
ThermoTST ATC860 adjusts the temperature (shell temperature or junction temperature) of the DUT to the target temperature point through direct contact between the test head and the DUT for corresponding performance testing. Suitable for both soldered chips and chips using sockets, it can truly control the temperature of the tested chip without affecting the peripheral circuit, eliminating the uncertainty caused by the peripheral circuit.
Characteristic
Effective temperature range, -70 ℃ to+200 ℃
Temperature stability ± 0.5 ℃
Touch screen operation, human-machine interaction interface
Support for DUT temperature control
Desktop design, low noise, low vibration, low environmental heat dissipation
Low temperature fluctuations
Low temperature environment testing without condensation
Application
Applicable to IC characteristics, testing, and failure analysis:
ATE, SLT, and Workbench
Replacement of high and low temperature test boxes/low-temperature cooling machines
OEM integration
Testing standards
Meet the United States Military Standard MIL system test standard
Meet the GJB system testing standards for domestic military components
Meet JEDEC testing requirements
Specifications
| Temperature Range | -70 ºC to + 200 ºC |
| Typical Temperature Transition Rate | 25ºC to -40 ºC ； ≤2Min |
| Temperature Accuracy | ± 1 ºC |
| Cooling power | 220W @ -40°C |
For more detailed parameters, please contact us!
